Air conducting device

ABSTRACT

An air conducting device includes a body, a baffle and a plurality of tongues. The body defines an airflow passageway therein. The baffle extends from the body to divide the airflow passageway into a first passageway and a second passageway. The first passageway is capable of receiving at least one first heat generating component therein. The second passageway is capable of receiving at least one second heat generating component therein. The first heat generating component is located in one of a plurality a slots. A plurality of tongues are located in the first passageway. Each tongue corresponds to the location of the plurality of slots. A guide channel is defined between every two adjacent tongues.

BACKGROUND

1. Technical Field

The present disclosure relates to air conduction, and particularly to anair conducting device in a computer.

2. Description of Related Art

Air conducting devices are often used in computers coupled with fans fordissipating heat from electronic components. A computer often includes aplurality of different heat generating components, such as CPUs,memories, and others. An airduct covers the heat generating components,and a fan is installed on or near the inlet to generate airflow todissipate heat from the heat generating components within the airduct.However, different heat generating components may work at differenttemperatures, such that one with higher temperature may elevate theoverall temperature in the airduct and affect the other componentstherein. In this way, the temperature of the affected heat generatingcomponents may exceed the temperature limit, and may be thereby damaged.In addition, when fewer heat generating components are installed,generated airflow exceeds the cooling requirements, translating towasted energy and hardware.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded, isometric view of an air conducting device, theair conducting device including a first chamber and a second chamber.

FIG. 2 is an assembled view of FIG. 1.

DETAILED DESCRIPTION

Referring to FIG. 1, an air conducting device 50 is configured to assistthe removal of heat from a plurality of first heat generatingcomponents, such as memories 20 and a plurality of second heatgenerating components, such as central processing units (CPUs) 14 bydirecting airflow flowing therethrough. The memories 20 are installed ina plurality of parallel slots 12 of a motherboard 10. The memories 20are optionally installed in the slots 12. The heat generating components14 are installed on the motherboard 10 adjacent to the slots 12. TheCPUs 14 may create more heat than the memories 20.

The air conducting device 50 includes a body, baffle 55, and a pluralityof tongues 572. The body includes a top wall 51 and two parallelsidewalls 53 extending downwardly therefrom. The top wall 51 is parallelto the motherboard 10. An airflow passageway is defined by the airconducting device 50 for directing the airflow therethrough. The baffle55 is parallel to the sidewalls 53 and extends downward from the topwall 51 to divide the airflow passageway into a first passageway 57 anda second passageway 58. The first passageway 57 is capable of receivingthe memories 20 therein, and the second passageway 58 is capable ofreceiving the CPUs 14 therein.

The tongues 572 perpendicularly extend from the top wall 51 towards theslots 12 in the first passageway 57. Each tongue 572 is rectangular.Each tongue 572 corresponds to each slot 12. A distal end of each tongue572 is flush with a top surface of each slot 12. Each tongue 572 isplaced adjacent to one end of each slot 12. The tongue 572 has a widththat is greater than the memories 20 configured to be located in theplurality of slots 12. A guide channel 574 is defined between twoadjacent tongues 572 for steadily directing the airflow to remove heatfrom the memories 20.

Referring to FIG. 2, the air conducting device 50 is mounted on themotherboard 10 to dissipate heat from two memories 20 and two CPUs 14.Each tongue 572 is positioned corresponding to the location of each slot12. As an example, two slots 12 here are not allocated with memories 20.Airflow 100 moves into the airflow passageway. Part of the airflowtravels through the guide channel 574 in the first passageway 57, suchthat the airflow is regularly directed by the tongues 572 regardless ofthe number of unused memories 20. When one or more memories 20 is addedor removed, heat dissipation efficiency in the first passageway 57remains unaffected. The other part of the airflow through the secondpassageway 58 dissipates heat from the CPUs 14. Accordingly, the airconducting device experiences steady heat dissipation efficiency, withno affect from the number of components deployed or the individualoperating temperatures thereof.

It is to be understood, however, that even though numerouscharacteristics and advantages have been set forth in the foregoingdescription of preferred embodiments, together with details of thestructures and functions of the preferred embodiments, the disclosure isillustrative only, and changes may be made in detail, especially inmatters of shape, size, and arrangement of parts within the principlesof the invention to the full extent indicated by the broad generalmeaning of the terms in which the appended claims are expressed.

1. An air conducting device comprising: a body defining an airflowpassageway therein; a baffle extending from the body to divide theairflow passageway into a first passageway and a second passageway, thefirst passageway being capable of receiving at least one first heatgenerating component therein, and the second passageway being capable ofreceiving at least one second heat generating component therein, thefirst heat generating component located in one of a plurality a slots;and a plurality of tongues located in the first passageway, each tonguecorresponding to the location of the plurality of slots, and a guidechannel being defined between every two adjacent tongues.
 2. The airconducting device of claim 1, wherein the tongues extend perpendicularlyfrom the body.
 3. The air conducting device of claim 1, wherein the bodycomprises a top wall and two parallel sidewalls extending down from thetop wall, wherein the baffle is parallel to the sidewalls.
 4. The airconducting device of claim 1, wherein the tongues have a width that isgreater than the first heating components configured to be located inthe plurality of slots.
 5. The air conducting device of claim 1, whereineach tongue is rectangular.
 6. An air conducting assembly comprising: amotherboard defining a plurality of slots capable of receiving at leastone first heat generating component; a body defining an airflowpassageway therein; and a plurality of tongues extending in thepassageway toward a top surface of each slot, each tongue being placedadjacent to one end of each slot, and a guide channel defined betweenevery two adjacent tongues.
 7. The air conducting assembly of claim 6,wherein the tongues extend perpendicularly from the body.
 8. The airconducting assembly of claim 6, wherein the body comprises a top walland two parallel sidewalls extending down from the top wall, wherein thebaffle is parallel to the sidewalls.
 9. The air conducting assembly ofclaim 6, wherein the tongues have a width that is greater than the firstheating component configured to be located in the slot.
 10. The airconducting assembly of claim 6, wherein each tongue is rectangular.